Mühldorf am Inn. ODU, an international front-runner in connector systems technology, will be present at electronica 2018 with numerous product innovations and proven all-rounders. The global trade fair for electronics component parts, systems and applications will take place in Munich from November 13 to 16. The connector specialist from Mühldorf will be setting new standards, particularly in the areas of impermeability, robustness, high density, mass interconnect, high temperatures, assembly speed and automatic docking systems.
A newcomer to the ODU-MAC® family
Since its market launch in 1986, the ODU-MAC® modular rectangular product family has become a true success story. With the ODU-MAC® RAPID, the company is now introducing a newcomer to this line, cutting assembly and service time in half thanks to a novel half-shell principle. This characteristic is complemented by multiple other intelligent features including high contact density, coding, and spindle locking along with easy adaptability to quickly changing requirements.
As a hybrid manual mating solution with spindle locking, the new ODU-MAC® Blue-Line performance class is characterized by the economical and user-friendly assembly and removal of crimp-clip contacts. A new combination module now achieves the highest packing density available on the market on a width of merely 14.4 mm. A unique selling point of the ODU-MAC® Blue-Line series is the well-established spindle locking, also available with the standard plastic housing.
ODU will also be presenting a pilot-production product from the ODU-MAC® Black-Line, the mass interconnect solution, with an innovative electromechanical locking mechanism.
In addition, the company will also be presenting a new development from the ODU DOCK Silver-Line at electronica 2018, an ideal solution for automatic docking and robotic systems. In this way, ODU will have integrated the existing ODU DOCK product line into the successful ODU-MAC® Silver-Line. The robust design, versatile application and flexible combination options, along with the quick-change head, will offer attractive benefits for ODU customers.
Visitors to the trade fair may also look forward to two additional outstanding highlights from the Bavarian innovation hotbed in Mühldorf: With its ODU-LAMTAC® HTC, the company will be introducing a new high-performance contact that excels through its maximum current-carrying capacity and temperature resistance of up to 200°C. Furthermore, the ODU DOCKING MATE self-finding contact system is setting new standards in important future markets as a brand-new development for autonomous driving and automated production.
When it comes to extreme ambient conditions, ODU’s thoroughly proven robust connector solutions are the number-one choice. ODU’s threaded connector technology is particularly suited to applications requiring a special degree of safety or in which ambient conditions including temperature, pressure or vibrations prove problematic. Thanks to its high shock and vibration resistance, shielding capacity, tightness, maximum operation, reliable transmission of high data rates and customized contact configurations, ODU guarantees reliability when it really matters.
Impermeability is among the most frequently demanded specifications in the areas of test and measurement as well as medical and industrial applications. Increasingly, this is not just about preventing water and dirt from intruding, even under high external pressure, but rather about hermetic sealing – such as for critical purity specifications, as when a vacuum must be created within a closed-off room. ODU is rising to this challenge with a new receptacle line from the ODU MINI-SNAP® series. Thanks to the glass potting, it doesn’t just meet the high demands on interfaces suitable for ultra-high vacuum conditions – ODU also enables high-performance data transmission with up to 14.4 Gbit/s.
New ODU MEDI-SNAP® applications suitable for high voltages prevent hot plugging thanks to a special pin layout design and new retarded contacts in tiny spaces of around 20 mm – in addition to reliable transmission of up to 1,000 V (AC), compliant with IEC 60664‑1. The complete mating condition can thus be characterized and a secondary deactivation be installed. Mating and demating of this high-voltage connector under load are excluded and long-term functional and operation security is guaranteed.
The IEC 60601-1 medical standard ensures even more safety in medical technology. It demands the highest contact security of medical devices and component parts to protect patients and operators from electric shock. Thanks to the integration of a dual protective measure, ODU MEDI-SNAP® solutions already comply with the new top security standard through new receptacle styles and insulating body designs.
To find out about our new products, visit ODU at electronica 2018, Hall B2, Booth 143. www.odu.de